A leaked slide has revealed the specifications of Qualcomm's latest Snapdragon 8 Gen 4, which will be available in two models- SM8750 and SM8750P, with the latter likely optimised for increased performance. The chipset is based on TSMC's 3nm node and features a 2+6 CPU arrangement. However, it is unknown whether this configuration contains eight Oryon cores or a combination of Oryon and Cortex cores, despite this, preliminary Geekbench findings reveal that the Snapdragon 8 Gen 4 outperforms the Gen 3 in both single and multi-core performance.
The Snapdragon 8 Gen 4 design prioritises power and thermal efficiency, which is critical for retaining performance in pocketable devices. Along with enhanced CPU, Qualcomm has introduced a new Adreno 8-series GPU, which offers improved performance and efficiency over its predecessor. The chipset also supports quad-channel LPDDR5X RAM, which improves memory speed and multitasking performance.
One of the Snapdragon 8 Gen 4's characteristics is the ‘Low-Power AI’ (LPAI) subsystem. This technology allows for always-on features such as audio processing, camera operation and sensor tracking without draining the battery. When the gadget is in active usage, a Neural Processing Unit (NPU) takes over, handling more complex AI operations.
Along with its processing capability, the Snapdragon 8 Gen 4 supports mmWave and sub-6GHz 5G (Rel. 17), Wi-Fi 7 (802.11be), Bluetooth 5.4 and Ultra-Wideband (UWB) with Qualcomm's FastConnect 7900 technology. As per industry insiders, numerous brands are ready to debut flagship devices powered by the Snapdragon 8 Gen 4, Xiaomi being expected to be the first one.