MediaTek Unveils Dimensity 9400 Flagship Chipset
The Dimensity 9400 is based on Arm's v9.2 CPU architecture and employs TSMC's second-generation 3nm technology
MediaTek has introduced the Dimensity 9400, its next flagship smartphone processor, which boasts major performance improvements and industry-first advancements in artificial intelligence (AI), gaming and networking. The Dimensity 9400, the fourth-generation chipset in MediaTek's flagship series, combines powerful CPU, GPU and NPU technologies to enable efficient, high-performance mobile apps.
Performance And Efficiency
The Dimensity 9400 is based on Arm's v9.2 CPU architecture and employs TSMC's second-generation 3nm technology. It includes one Cortex-X925 core (3.62GHz), three Cortex-X4 cores and four Cortex-A720 cores. This configuration outperforms the older Dimensity 9300 chipset by 35 per cent for single-threaded performance and 28 per cent for sustained multicore performance. It is also 40 per cent more power efficient, making it suitable for those who require both performance and long battery life.
MediaTek's 8th generation NPU enhances AI-driven apps by introducing the world's first on-device LoRA training and high-quality video creation. The NPU's enhanced design achieves 80 per cent quicker large language model (LLM) prompt performance and 100 per cent higher diffusion generation performance, all while using 35 per cent less power than its predecessor. MediaTek's Dimensity Agentic AI Engine (DAE) simplifies AI integration by providing a consistent interface for AI agents, models and third-party applications.
Enhanced Graphics
The 12-core Arm Immortalis-G925 GPU boosts peak performance by 41 per cent and improves raytracing by 40 per cent, resulting in smoother, more immersive gaming experiences. The chipset also supports opacity micromaps (OMM), which provide realistic visual effects, making it suitable for graphics-intensive applications. MediaTek's HyperEngine Technology and co-developed Arm Accurate Super Resolution (ASR) increase the gaming experience by providing super-resolution and improved picture quality, while reducing power consumption by up to 44 per cent during gaming sessions.
Camera And Imaging Features
The MediaTek Imagiq 1090 ISP improves mobile photography with full-range HDR zoom and Generative-AI Super Zoom, allowing users to shoot high-quality photographs even at a distance. The chipset supports 4K60 video capture and uses 14 per cent less power than its predecessor, allowing users to record high-quality films without sacrificing battery life. Smooth Zoom technology maintains sharp focus even while photographing moving things.
Connectivity
The Dimensity 9400 features a redesigned 3GPP Release-17 5G modem with 4CC-CA and up to 7Gbps sub-6GHz performance, offering ultra-fast 5G speeds. The new 4nm Wi-Fi/Bluetooth combo chip supports Wi-Fi 7 with tri-band MLO and can deliver data rates of up to 7.3Gbps. The processor also uses 50 per cent less power in wireless communication than its predecessor. The MediaTek Xtra Range 3.0 extends Wi-Fi coverage by up to 30 metres, and Phone-to-Phone direct Bluetooth connections can travel up to 1.5 km. The 5G/4G Dual SIM Dual Active (DSDA) functionality enables customers to manage two active 5G or 4G connections at the same time. The chipset also allows tri-fold smartphones, allowing device manufacturers to develop with larger, more adaptable displays.
AI-driven Applications
With the addition of the Dimensity Agentic AI Engine (DAE), the chipset now supports advanced AI applications that integrate smoothly with edge and cloud services. This technology seeks to speed the development of agentic AI apps by providing developers with a uniform platform for connecting several AI models and third-party apps.
Availability
The MediaTek Dimensity 9400 will power the first smartphones accessible in Q4 2024.
