ASMPT and IBM have renewed their partnership to advance chiplet packaging technologies. The two companies will work together to improve thermocompression and hybrid bonding technologies for chiplet packages. ASMPT will use its next-generation Firebird TCB and Lithobolt hybrid bonding tools for this effort.
Chiplets are tiny components that, when joined, act as a single system, with possible benefits including increased energy efficiency, quicker development cycles and lower prices. To move chiplets from research to mass manufacturing, innovations in packaging technology are essential, particularly considering the fast advancements in AI computing.
The current collaboration between ASMPT and IBM, which previously unveiled a hybrid bonding method intended to enhance the bonding quality between chiplets, is strengthened by this new arrangement. The goal of the new partnership is to advance chiplet packaging bonding technology.
Huiming Bu, Vice President of IBM Research's Albany Operations and Global R&D at IBM Semiconductors, underlined the company's continued dedication to creating packaging solutions that make semiconductors lighter, faster and more energy-efficient. ASMPT's Senior Vice President, Lim Choon Khoon, expressed how excited the business is to work with IBM to develop packaging and heterogeneous integration solutions for the AI future.
